Ke hoʻokele nei i nā ʻano haʻalulu a me ka neʻe ʻana i ka hana ʻana o ka Semiconductor 2026

I ka hahai ikaika ʻana o ka ʻoihana semiconductor i nā kikowaena hana sub-2nm, ua nalowale loa ka palena no ka hewa mechanical. Ma kēia ʻano kiʻekiʻe, ʻaʻole ia he mea hopohopo lua ka paʻa o ke keʻena hana; ʻo ia ka bottleneck mua no ka hua. Ma ZHHIMG, ke nānā nei mākou i kahi hoʻololi nui i ke ʻano o ka hoʻokokoke ʻana o nā OEM honua i ka pono o nā lako kapikala semiconductor.

ʻO ke Kino o ka Noho Mālie: Nā ʻenehana Hoʻemi Haʻalulu Kiʻekiʻe

I ka hana ʻana o nā wafer hou, ʻo nā haʻalulu i manaʻo ʻia he "walaʻau hope" i kēia manawa ua lilo i mea weliweli. Inā paha he micro-oscillations mai ka ʻōnaehana HVAC o kahi hale a i ʻole ka inertia kūloko o kahi kahua scan wikiwiki, unuhi pololei ka ikehu i kāohi ʻole ʻia i nā hewa overlay a me nā ʻano blurred.

Ua ulu aʻe nā ʻano hana damping haʻalulu o kēia manawa i ka hana semiconductor i loko o kahi hoʻolālā multi-layered. ʻOiai ʻo ka damping passive—me ka hoʻohana ʻana i nā mea kiʻekiʻe e like me ka hoʻolei mineral a i ʻole ka granite precision—ke kumu mau nei, ke ʻike nei mākou i ka piʻi ʻana o ka hoʻohui damping hana.

Hoʻohana nā ʻōnaehana hana i nā actuators piezoelectric a me nā sensor manawa maoli e "hoʻōki" i nā haʻalulu ma o ka hoʻoulu ʻana i nā alapine kūʻē. Eia nō naʻe, ua kaupalena ʻia ka pono o nā ʻōnaehana hana e ka ratio damping o ka mea kumu. ʻO kēia kahi e lilo ai ka ʻike loea o ZHHIMG i nā mea kūkulu damping kiʻekiʻe i mea koʻikoʻi. Ma ka hoʻohui ʻana i nā mea uila hana me kahi granite inert kūlohelohe a i ʻole ke kumu composite, hāʻawi mākou i kahi "Quiet Zone" kahi e hiki ai ke hoʻonohonoho nano me ka ʻole o ke keakea.

Ka Piʻi ʻana o ka Neʻe ʻAʻohe Friction: ʻenehana Bearing Air

Ua hoʻokuke ke koi no ka throughput kiʻekiʻe i nā bearings mechanical kuʻuna i ko lākou mau palena. ʻO ka friction e alakaʻi i ka wela, a ʻo ka wela e alakaʻi i ka hoʻonui ʻana o ka thermal—ka ʻenemi o ka pololei. Ua alakaʻi kēia i ka hoʻohana nui ʻia ʻana oʻenehana hali ea no nā pae kikoʻī.

Kākoʻo nā bearings ea i kahi ukana ma luna o kahi ʻili lahilahi o ka ea i hoʻopaʻa ʻia, maʻamau he mau microns wale nō ka mānoanoa. No ka mea ʻaʻohe pilina kino, ʻaʻohe friction static (sticky). ʻAe kēia no:

• Neʻe ʻole Hysteresis: E hōʻoia ana e hoʻi ke kahua i ka hoʻonohonoho nanometer like i kēlā me kēia manawa.

• Ka Paʻa o ka Velocity: He mea koʻikoʻi no nā noi scan e like me ka nānā ʻana o ka E-beam kahi e hoʻopilikia ai ka "cogging" liʻiliʻi loa o kahi bearing mechanical i ke kiʻi.

• Ka Lōʻihi Loa: ʻOiai ʻaʻohe ʻāpana e hoʻopā ana, ʻaʻohe ʻaʻahu a ʻaʻohe hanauna particulate, e kūpono ana iā lākou no nā wahi lumi maʻemaʻe Papa 1.

Ma ZHHIMG, hana mākou i nā ʻili granite pālahalaha loa e lawelawe ana ma ke ʻano he alakaʻi no kēia mau bearings ea. I mea e hana pono ai, pono e hoʻopili ʻia kēia mau ʻili i kahi pālahalaha i ana ʻia ma nā hapa o ka nalu māmā.

Nā ʻano hana i nā lako waiwai Semiconductor: 2026 a ma ʻō aku

I ko kākou neʻe ʻana i ka makahiki 2026,nā ʻano hana i nā lako kapikala semiconductorua hōʻailona ʻia e "Nā Kia ʻEkolu": Modularization, Sustainability, a me ka Thermal Control.

1. Hoʻolālā Paepae Modular: Ke ʻimi nei nā OEM i nā modula kumu "plug-and-play". Ma kahi o ka hoʻolālā ʻana i kahi kumu hou no kēlā me kēia mea hana, ke hoʻohana nei lākou i nā kumu pololei ZHHIMG maʻamau i hiki ke hoʻololi ʻia no ka lithography, metrology, a i ʻole etching.

2. Hoʻokele Wela: ʻOiai ʻo nā kumu kukui EUV (Extreme Ultraviolet) e hoʻopuka i ka wela nui, pono ke kumu mīkini e hana ma ke ʻano he poho wela nui. Ke hoʻohui nei mākou i nā kahawai hoʻoluʻu paʻakikī i loko o kā mākou mau ʻāpana mineral a me ka granite e mālama i kahi delta o $<0.01^\circ\text{C}$.

3. Hoʻohālikelike ʻana i ka Vacuum: Me nā kaʻina hana hou aʻe e neʻe ana i nā wahi vacuum kiʻekiʻe, pono e loaʻa i nā mea i hoʻohana ʻia ka ʻole o ka outgassing. ʻO kā mākou hana granite a me ka keramika kūikawā e hōʻoiaʻiʻo ana ʻaʻole e hoʻopilikia ʻia ka pono o ka vacuum e ke kahua kūkulu.

Ka Hui Hoʻolālā me ZHHIMG

ʻAʻole ʻo ZHHIMG wale nō kahi mea hana ʻāpana; he hoa hana koʻikoʻi mākou i ke kaulahao hoʻolako kaohi neʻe. Hana pū kā mākou hale hana ma Kina me nā hui ʻenekinia ma Silicon Valley a me Eindhoven e hoʻoponopono i nā pilikia paʻakikī loa o ka ʻoihana.

Ma ka hoʻohana ʻana i kā mākou ʻano hana lapping ponoʻī a me ko mākou ʻike hohonu onā ʻano hana hoʻēmi haʻalulu, hiki iā mākou i kā mākou mea kūʻai aku ke hoʻokuke i nā palena o ke Kānāwai Moore. Inā ʻoe e hoʻomohala nei i kahi mea hana ALD (Atomic Layer Deposition) hanauna hou a i ʻole kahi mea noi wafer wikiwiki, hoʻomaka ke kahua me ZHHIMG.

Hopena

ʻO ka ulu ʻana o ka hana semiconductor he heihei kūʻē i nā kānāwai o ke kino. I ka neʻe ʻana o ka ʻoihana i ka makahiki 2026, e hoʻoikaika wale ʻia ka nānā ʻana i ka pololei o ka ea a me ka damping holomua. ʻO ka noho ʻana i mua o kēia mau ʻano e pono ai kahi kahua—ma ke ʻano maoli a me ke ʻano hoʻohālikelike—i kūkulu ʻia ma luna o ka ʻike loea a me ka hana hou.